Invention Grant
- Patent Title: Strong, heat stable junction
-
Application No.: US13657957Application Date: 2012-10-23
-
Publication No.: US10026708B2Publication Date: 2018-07-17
- Inventor: Patrick J Taylor , Sudhir Trivedi , Wendy L Sarney
- Applicant: U.S. Army Research Laboratory ATTN: RDRL-LOC-I
- Applicant Address: US DC Washington
- Assignee: The United States of America as represented by the Secretary of the Army
- Current Assignee: The United States of America as represented by the Secretary of the Army
- Current Assignee Address: US DC Washington
- Agent Eric Brett Compton
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/00
Abstract:
Provided among other things is an electrical device comprising: a first component that is a semiconductor or an electrical conductor; a second component that is an electrical conductor; and a strong, heat stable junction there between including an intermetallic bond formed of: substantially (a) indium (In), tin (Sn) or a mixture thereof, and (b) substantially nickel (Ni). The junction can have an electrical contact resistance that is small compared to the resistance of the electrical device.
Public/Granted literature
- US20140110848A1 STRONG, HEAT STABLE JUNCTION Public/Granted day:2014-04-24
Information query
IPC分类:
