Electronic assemblies including electronic devices mounted on non-planar subrates

Invention Grant

US10026719B2 Electronic assemblies including electronic devices mounted on non-planar subrates 有权

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Patent Title: Electronic assemblies including electronic devices mounted on non-planar subrates
Application No.: US14959072

Application Date: 2015-12-04
Publication No.: US10026719B2

Publication Date: 2018-07-17
Inventor: Colleen Louise Khalifa , Harry George Kellzi
Applicant: Teledyne Reynolds, Inc.
Applicant Address: US CA Thousand Oaks
Assignee: Teledyne Reynolds, Inc.
Current Assignee: Teledyne Reynolds, Inc.
Current Assignee Address: US CA Thousand Oaks
Agency: K&L Gates LLP
Main IPC: H01L23/02
IPC: H01L23/02 ; H01L23/34 ; H01L23/12 ; H01L25/10

Electronic assemblies including electronic devices mounted on non-planar subrates

Abstract:

The electronic assemblies described in this specification are characterized by a non-planar low-temperature co-fired ceramic substrate on which an electronic device is mounted.

Public/Granted literature

US20170162549A1 ELECTRONIC ASSEMBLIES Public/Granted day:2017-06-08

Information query

Espacenet

IPC分类:

H	电学
H01	基本电气元件
H01L	半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L23/00	半导体或其他固态器件的零部件（H01L25/00优先）
H01L23/02	.容器；封接（H01L23/12，H01L23/34，H01L23/48，H01L23/552优先）