An integrated circuit package including a substrate having a cavity and one or more semiconductor devices assembled within the cavity of the substrate. The one or more semiconductor devices electrically coupled using redistribution layers, wherein the cavity is a first cavity, the substrate includes the first cavity and a second cavity, the one or more semiconductor devices are fully embedded within the first cavity of the substrate, the one or more semiconductor devices are fully embedded between the substrate and a first redistribution layer of said redistribution layers, bumps are fully embedded within the second cavity of the substrate, the bumps are fully embedded between the substrate and the first redistribution layer of said redistribution layers, and the first redistribution layer is fully embedded between the substrate and a semiconductor interposer.