- Patent Title: Fin-type field effect transistor and manufacturing method thereof
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Application No.: US15054086Application Date: 2016-02-25
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Publication No.: US10026838B2Publication Date: 2018-07-17
- Inventor: Cheng-Ta Wu , Yung-Yu Wang , Yung-Hsiang Chan , Chia-Ying Tsai , Ting-Chun Wang
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: JCIPRNET
- Main IPC: H01L29/76
- IPC: H01L29/76 ; H01L29/78 ; H01L21/02 ; H01L21/8234 ; H01L27/088

Abstract:
A fin-type field effect transistor comprising a substrate, at least one gate structure, spacers and strained source and drain regions is described. The at least one gate structure is disposed over the substrate and on the isolation structures. The spacers are disposed on sidewalls of the at least one gate structure. First blocking material layers are disposed on the spacers. The strained source and drain regions are disposed at two opposite sides of the at least one gate structure. Second blocking material layers are disposed on the strained source and drain regions. The first and second blocking material layers comprise oxygen-rich oxide materials.
Public/Granted literature
- US20170250280A1 FIN-TYPE FIELD EFFECT TRANSISTOR AND MANUFACTURING METHOD THEREOF Public/Granted day:2017-08-31
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