Invention Grant
- Patent Title: Package-less LED assembly and method
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Application No.: US15043540Application Date: 2016-02-13
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Publication No.: US10026864B2Publication Date: 2018-07-17
- Inventor: Scott Brad Herner
- Applicant: Scott Brad Herner
- Applicant Address: US CO Lafayette
- Assignee: BLACK PEAK LLC
- Current Assignee: BLACK PEAK LLC
- Current Assignee Address: US CO Lafayette
- Agent Scott Brad Herner
- Main IPC: H01L33/00
- IPC: H01L33/00

Abstract:
This application describes an assembly suitable for emitting light, and methods of forming the same. The assembly includes a single crystal substrate with first and second surfaces, a plurality of LEDs in immediate contact with the first surface of the substrate. The LEDs are substantially crystal lattice matched with the substrate. The plurality of LEDs includes three or more LEDs that are not in electrical contact with any other LED, and there is a gap between each LED of the plurality and its nearest neighbor LED. The assembly includes phosphor-containing encapsulant layers overlying at least a portion of the LEDs.
Public/Granted literature
- US20170238419A1 Package-less LED Assembly and Method Public/Granted day:2017-08-17
Information query
IPC分类: