A thin film package structure is provided. The thin film package structure includes a plurality of film layers arranged on the outside of a device, the plurality of film layers including inorganic and organic layers alternately laminated, wherein the innermost film layer and the outermost film layer among the plurality of film layers are inorganic layers, and an auxiliary spreading layer arranged between at least one pair of an inorganic layer and an organic layer adjacent within the plurality of film layers, wherein the hydrophilicity-hydrophobicity of the auxiliary spreading layer is the same as that of the organic layer in contact with the auxiliary spreading layer.