Invention Grant
- Patent Title: Printed circuit board structure and method of manufacturing using wideband microstrip lines
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Application No.: US14943938Application Date: 2015-11-17
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Publication No.: US10027010B2Publication Date: 2018-07-17
- Inventor: Rashad Ramzan , Omar Farooq Sidiqui , Azam Beg
- Applicant: UNITED ARAB EMIRATES UNIVERSITY
- Applicant Address: AE
- Assignee: United Arab Emirates University
- Current Assignee: United Arab Emirates University
- Current Assignee Address: AE
- Agency: Hayes Soloway PC
- Main IPC: H01P5/02
- IPC: H01P5/02 ; H01P3/08 ; H05K3/12 ; H05K1/02 ; B33Y10/00 ; B33Y80/00

Abstract:
There is provided a printed circuit board structure, a dielectric substrate structure and a method of manufacturing thereof using wideband microstrip lines for reducing signal reflection, resonance and radiation for maintaining signal quality. The widths of certain portions of the wideband microstrips and underlying substrate portions are tapered gradually for achieving a reduction in a signal reflection, resonance and radiation therefore resulting in maintaining signal quality.
Public/Granted literature
- US20170141447A1 PRINTED CIRCUIT BOARD STRUCTURE AND METHOD OF MANUFACTURING USING WIDEBAND MICROSTRIP LINES Public/Granted day:2017-05-18
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