A waterproof connection apparatus for electronic equipment includes: an approximately tubular outer case; a supporting portion accommodated in a wall form on a deep side of the outer case; a contact terminal supported by the supporting portion and introduced in the outer case; and a circumferential sealing portion provided at a position between the outer case and the supporting portion to seal a space between the outer case and the supporting portion. The sealing portion formed of an elastic material is provided so as to protrude outward from a portion of an outer circumferential surface of the supporting portion and the sealing portion is pressure-contacted to an inner surface of the outer case in a circumferential form in a state of press-fitting the protruding portion. In this way, it is possible to reliably prevent water from entering into the deep side of the outer case and to decrease the length.