Invention Grant
- Patent Title: Integrated circuit
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Application No.: US15387755Application Date: 2016-12-22
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Publication No.: US10027282B2Publication Date: 2018-07-17
- Inventor: Takumi Sugitani , Hitoshi Kurusu
- Applicant: Mitsubishi Electric Corporation
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Tokyo
- Agency: Studebaker & Brackett PC
- Priority: JP2016-084659 20160420
- Main IPC: H03F1/02
- IPC: H03F1/02 ; H01L23/00 ; H03F3/195 ; H03F3/45 ; H03F1/08 ; H03F3/187

Abstract:
According to the present invention, an integrated circuit includes a first amplifier stage, a second amplifier stage, a first signal line connecting an output of the first amplifier stage and an input of the second amplifier stage to each other, a first plane for ground connected to the first amplifier stage, a second plane for ground connected to the second amplifier stage and at least one at least one line for ground connecting the first plane and the second plane to each other, wherein the at least one line has a center line having a length of 10 μm to 1 mm, a width of the at least one line is ⅓ or less of a width of the first plane, and a pattern ratio is 1 or more.
Public/Granted literature
- US20170310279A1 INTEGRATED CIRCUIT Public/Granted day:2017-10-26
Information query
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