Invention Grant
- Patent Title: Multiple camera computational wafer inspection
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Application No.: US14526484Application Date: 2014-10-28
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Publication No.: US10027928B2Publication Date: 2018-07-17
- Inventor: Sri Rama Prasanna Pavani
- Applicant: Sri Rama Prasanna Pavani
- Applicant Address: US CA Fremont
- Assignee: Exnodes Inc.
- Current Assignee: Exnodes Inc.
- Current Assignee Address: US CA Fremont
- Main IPC: H04N7/18
- IPC: H04N7/18 ; G01N21/95

Abstract:
A system and method for inspecting a surface, comprising: illuminating said surface with an electromagnetic radiation to generate scattered radiation, having a plurality of scattering angles, from features of said surface; collecting said scattered radiation from said surface at two or more positions, with radiation collected at each position forming an image of a plurality of points on said surface by collecting a portion of said scattered radiation propagating in a subset of said scattering angles; detecting images of surface at two or more said positions; and combining information from two or more said images of surface to generate a global information set, having information from a plurality of said scattering angles collected by two or more said imaging modules, whereby said features of said surface are detected in said images of surface and in said global information set.
Public/Granted literature
- US20160116419A1 MULTIPLE CAMERA WAFER INSPECTION Public/Granted day:2016-04-28
Information query