Invention Grant
- Patent Title: Headphones
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Application No.: US15428733Application Date: 2017-02-09
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Publication No.: US10028048B2Publication Date: 2018-07-17
- Inventor: Hiromichi Ozawa
- Applicant: AUDIO-TECHNICA CORPORATION
- Applicant Address: JP Machida-shi, Tokyo
- Assignee: AUDIO-TECHNICA CORPORATION
- Current Assignee: AUDIO-TECHNICA CORPORATION
- Current Assignee Address: JP Machida-shi, Tokyo
- Agent Manabu Kanesaka
- Priority: JP2016-038864 20160301
- Main IPC: H04R25/00
- IPC: H04R25/00 ; H04R1/10 ; H04R1/28

Abstract:
A headphone includes a baffle plate, a driver unit attached to the baffle plate, a housing forming a back cavity at a front side of the baffle plate and the driver unit, and an ear pad attached to a peripheral edge portion of the baffle plate at a front side and forming the front cavity at the front side of the baffle plate, and the baffle plate includes at least one through hole that allows the back cavity and the front cavity to acoustically communicate with each other. The sound wave emitted from the driver unit to the back cavity passes through the through hole and cancels a low-frequency range sound wave of a sound wave emitted from the driver unit to the front cavity, so that sound quality in a low-frequency range is improved.
Public/Granted literature
- US20170257690A1 HEADPHONES Public/Granted day:2017-09-07
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