- Patent Title: Multi-layer heat spreader assembly with isolated convective fins
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Application No.: US14912158Application Date: 2014-07-31
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Publication No.: US10028372B2Publication Date: 2018-07-17
- Inventor: Darin Bradley Ritter , Mark Robert Anderson
- Applicant: THOMSON LICENSING
- Applicant Address: FR Issy-les-Moulineaux
- Assignee: THOMSON Licensing
- Current Assignee: THOMSON Licensing
- Current Assignee Address: FR Issy-les-Moulineaux
- Agent Jerome G. Schaefer; Richard Laperuta
- International Application: PCT/US2014/049110 WO 20140731
- International Announcement: WO2015/023447 WO 20150219
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H05K1/02
Abstract:
An assembly of two or more heatspreaders is attached to a printed circuit board in a compact electronic enclosure. The heatspreaders include fins which assist in convecting heat out of the enclosure through vents. The printed circuit board is shielded from the outer case by the heatspreaders.
Public/Granted literature
- US20160205762A1 MULTI-LAYER HEAT SPREADER ASSEMBLY WITH ISOLATED CONVECTIVE FINS Public/Granted day:2016-07-14
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