Invention Grant
- Patent Title: Resin composition, prepreg and metal foil-clad laminate
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Application No.: US14348266Application Date: 2012-08-24
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Publication No.: US10028377B2Publication Date: 2018-07-17
- Inventor: Naoki Oka , Syouichi Itoh , Masataka Kudo , Michio Yaginuma
- Applicant: Naoki Oka , Syouichi Itoh , Masataka Kudo , Michio Yaginuma
- Applicant Address: JP Tokyo
- Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.
- Current Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.
- Current Assignee Address: JP Tokyo
- Agency: Greenblum & Bernstein, P.L.C.
- Priority: JP2011-216480 20110930
- International Application: PCT/JP2012/071447 WO 20120824
- International Announcement: WO2013/047041 WO 20130404
- Main IPC: C08F299/02
- IPC: C08F299/02 ; H05K1/03 ; C08J5/24 ; C08L71/12

Abstract:
Provided are a resin composition having excellent electrical characteristics and heat resistance after moisture absorption, and being also excellent in flowing characteristics at the time of production of a laminate, and a prepreg, a metal foil-clad laminate and a resin sheet using the same. Used is a resin composition comprising a bifunctional phenylene ether oligomer (a) having a polyphenylene ether skeleton, an aralkyl-based cyanate ester compound (b), a bisphenol-based cyanate ester compound (c), an epoxy resin (d), a brominated carbonate oligomer (e), an inorganic filler (f), an alkoxynaphthol-based polymerization inhibitor (g) and/or a thioether-based polymerization inhibitor (h).
Public/Granted literature
- US20140370771A1 RESIN COMPOSITION, PREPREG AND METAL FOIL-CLAD LAMINATE Public/Granted day:2014-12-18
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