Invention Grant
- Patent Title: Connector, circuit board module and circuit board module array including same
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Application No.: US15120210Application Date: 2015-02-13
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Publication No.: US10028383B2Publication Date: 2018-07-17
- Inventor: Jun Seok Park
- Applicant: LG INNOTEK CO., LTD.
- Applicant Address: KR Seoul
- Assignee: LG INNOTEK CO., LTD.
- Current Assignee: LG INNOTEK CO., LTD.
- Current Assignee Address: KR Seoul
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: KR10-2014-0020291 20140221
- International Application: PCT/KR2015/001450 WO 20150213
- International Announcement: WO2015/126101 WO 20150827
- Main IPC: H05K1/11
- IPC: H05K1/11 ; H05K1/14 ; H01R12/72 ; H01R12/73 ; H05K3/36 ; H05K3/34 ; H01L33/62 ; H01R24/84 ; H01R103/00 ; H05K1/18
Abstract:
In one embodiment, provided is a connector comprising: a body; a first protrusion formed on a first surface of the body; a first groove formed on the first surface of the body to be adjacent to the first protrusion, and of which the shape includes the inverse of the first protrusion; a first terminal of which at least a portion is arranged to correspond to the first protrusion; and a second terminal of which at least a portion is arranged to correspond to the first groove.
Public/Granted literature
- US20170064827A1 CONNECTOR, CIRCUIT BOARD MODULE AND CIRCUIT BOARD MODULE ARRAY INCLUDING SAME Public/Granted day:2017-03-02
Information query
