Invention Grant
- Patent Title: Composite electronic component and board having the same
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Application No.: US15297865Application Date: 2016-10-19
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Publication No.: US10028386B2Publication Date: 2018-07-17
- Inventor: Heung Kil Park , Jong Hwan Park , Young Ghyu Ahn
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2016-0033215 20160321
- Main IPC: H01G4/38
- IPC: H01G4/38 ; H05K1/18 ; H01G4/005 ; H01G4/018 ; H01G4/228 ; H01G4/30 ; H01G9/042 ; H01G9/08 ; H01G15/00 ; H05K1/02 ; H05K1/11
Abstract:
A composite electronic component includes a multilayer capacitor; a tantalum capacitor; a lead frame disposed between the multilayer capacitor and the tantalum capacitor and electrically connecting the multilayer capacitor and the tantalum capacitor to each other; and an encapsulation member encapsulating the multilayer capacitor and the tantalum capacitor so that a portion of the lead frame is exposed.
Public/Granted literature
- US20170273184A1 COMPOSITE ELECTRONIC COMPONENT AND BOARD HAVING THE SAME Public/Granted day:2017-09-21
Information query
