An electronic part bonding substrate includes a substrate, an electronic part mounted on the substrate, a first terminal that extends outwardly from the electronic part, a second terminal that extends outwardly from the first terminal, and a third terminal that extends outwardly from the second terminal, wherein the second terminal being a member having a thermal conductivity lower than a thermal conductivity of a member of the first terminal and a member of the third terminal, and the third terminal being partly or entirely bonded to the substrate by soldering or by a conductive bonding agent.