Invention Grant
- Patent Title: Liquid handling device
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Application No.: US15117030Application Date: 2015-02-10
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Publication No.: US10029255B2Publication Date: 2018-07-24
- Inventor: Ken Kitamoto
- Applicant: Enplas Corporation
- Applicant Address: JP Saitama
- Assignee: ENPLAS CORPORATION
- Current Assignee: ENPLAS CORPORATION
- Current Assignee Address: JP Saitama
- Agency: Brundidge & Stanger, P.C.
- Priority: JP2014-023510 20140210
- International Application: PCT/JP2015/053650 WO 20150210
- International Announcement: WO2015/119290 WO 20150813
- Main IPC: B01L3/00
- IPC: B01L3/00

Abstract:
This liquid handling device is provided with a first chip that comprises a first substrate, a first film, a first flow path, a second flow path and a partition wall. A diaphragm portion of the first film is over the first flow path, the second flow path and the partition wall, and the center thereof is arranged over the first flow path. The first chip comprises a discharge hole or a discharge flow path which, in the liquid flow direction in the first flow path, opens into the first flow path between the partition wall and the center of the diaphragm and allows communication between the inside and outside of the first flow path.
Public/Granted literature
- US20170173583A1 LIQUID HANDLING DEVICE Public/Granted day:2017-06-22
Information query
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