Various embodiments relating to semiconductor package structures having reduced thickness while maintaining rigidity are provided. In one embodiment, a semiconductor package structure includes a substrate including a surface, a semiconductor die including a first interface surface connected to the surface of the substrate and a second interface surface opposing the first interface surface, a mold compound applied to the substrate surrounding the semiconductor die. The second interface surface of the semiconductor die is exposed from the mold compound. The semiconductor package structure includes a heat dissipation cover attached to the second interface surface of the semiconductor die and the mold compound.