Invention Grant
- Patent Title: Semiconductor device and manufacturing method thereof
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Application No.: US15340785Application Date: 2016-11-01
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Publication No.: US10032740B2Publication Date: 2018-07-24
- Inventor: Jong Sik Paek , Doo Hyun Park
- Applicant: Amkor Technology, Inc.
- Applicant Address: US AZ Tempe
- Assignee: Amkor Technology, Inc.
- Current Assignee: Amkor Technology, Inc.
- Current Assignee Address: US AZ Tempe
- Agency: McAndrews, Held & Malloy, Ltd.
- Priority: KR10-2014-0012762 20140204
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L23/31 ; H01L21/56 ; H01L25/10 ; H01L23/538
Abstract:
A semiconductor device and manufacturing method thereof. Various aspects of the disclosure may, for example, comprise forming a back end of line layer on a dummy substrate, completing at least a first portion of an assembly, and removing the dummy substrate.
Public/Granted literature
- US20170062372A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF Public/Granted day:2017-03-02
Information query
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