Invention Grant
- Patent Title: Static random access memory and manufacturing method thereof
-
Application No.: US15059021Application Date: 2016-03-02
-
Publication No.: US10032782B2Publication Date: 2018-07-24
- Inventor: Kuo-Hsiu Hsu , Chong-De Lien
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: McDermott Will & Emery LLP
- Main IPC: H01L27/088
- IPC: H01L27/088 ; H01L27/11 ; H01L27/105 ; H01L29/66 ; H01L29/06 ; H01L29/78 ; H01L27/02 ; H01L29/423

Abstract:
A static random access memory (SRAM) cell includes first through fourth transistors being first type transistors and fifth and sixth transistors being second type transistors. Source regions of the first and second transistors are formed by a first source diffusion region, source regions of the fifth and sixth transistors are formed by second and third source diffusion regions, respectively, and source regions of the third and fourth transistors are formed by a fourth source diffusion region. The SRAM cell further includes a first data storage electrode linearly extending from a first gate line of the third and sixth transistors and electrically connecting the first gate line and the first and second source diffusion regions, and a second data storage electrode linearly extending from a second gate line of the second and fifth transistors and electrically connecting the second gate line and the third and fourth source diffusion regions.
Public/Granted literature
- US20170256548A1 STATIC RANDOM ACCESS MEMORY AND MANUFACTURING METHOD THEREOF Public/Granted day:2017-09-07
Information query
IPC分类: