Semiconductor memory device

Invention Grant

US10032788B2 Semiconductor memory device 有权

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Patent Title: Semiconductor memory device
Application No.: US15064760

Application Date: 2016-03-09
Publication No.: US10032788B2

Publication Date: 2018-07-24
Inventor: Shigeki Hattori , Masaya Terai , Hideyuki Nishizawa , Koji Asakawa
Applicant: Toshiba Memory Corporation
Applicant Address: JP Minato-ku
Assignee: TOSHIBA MEMORY CORPORATION
Current Assignee: TOSHIBA MEMORY CORPORATION
Current Assignee Address: JP Minato-ku
Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
Priority: JP2015-060237 20150324
Main IPC: H01L29/792
IPC: H01L29/792 ; H01L27/115 ; H01L29/51 ; H01L27/11582 ; H01L51/00 ; H01L27/28 ; H01L51/05

Abstract:

A semiconductor memory device according to an embodiment includes a semiconductor layer, a control gate electrode, and an organic molecular layer provided between the semiconductor layer and the control gate electrode, and the organic molecular layer having an organic molecule that includes a molecular structure described by a molecular formula (1):

Public/Granted literature

US20160284869A1 SEMICONDUCTOR MEMORY DEVICE Public/Granted day:2016-09-29

Information query

Espacenet

IPC分类:

H	电学
H01	基本电气元件
H01L	半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L29/00	专门适用于整流、放大、振荡或切换，并具有至少一个电位跃变势垒或表面势垒的半导体器件；具有至少一个电位跃变势垒或表面势垒，例如PN结耗尽层或载流子集结层的电容器或电阻器；半导体本体或其电极的零部件（H01L31/00至H01L47/00，H01L51/05优先；除半导体或其电极之外的零部件入H01L23/00；由在一个共用衬底内或其上形成的多个固态组件组成的器件入H01L27/00）
H01L29/66	.按半导体器件的类型区分的
H01L29/68	..只能通过对一个不通有待整流、放大或切换的电流的电极供给电流或施加电位方可进行控制的（H01L29/96优先）
H01L29/76	...单极器件
H01L29/772	....场效应晶体管
H01L29/78	.....由绝缘栅产生场效应的
H01L29/792	......带有电荷捕获栅绝缘体，例如MNOS存储晶体管