Invention Grant
- Patent Title: FinFET devices having asymmetrical epitaxially-grown source and drain regions and methods of forming the same
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Application No.: US14695411Application Date: 2015-04-24
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Publication No.: US10032910B2Publication Date: 2018-07-24
- Inventor: Xusheng Wu , Changyong Xiao , Min-hwa Chi
- Applicant: GLOBALFOUNDRIES, INC.
- Applicant Address: KY Grand Cayman
- Assignee: GLOBALFOUNDRIES, INC.
- Current Assignee: GLOBALFOUNDRIES, INC.
- Current Assignee Address: KY Grand Cayman
- Agency: Lorenz & Kopf, LLP
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/08 ; H01L27/088 ; H01L29/66 ; H01L21/3115 ; H01L29/165

Abstract:
Fin field-effect transistor (FinFET) devices and methods of forming the same are provided herein. In an embodiment, a FinFET device includes a semiconductor substrate having a plurality of fins disposed in parallel relationship. A first insulator layer overlies the semiconductor substrate, with the fins extending through and protruding beyond the first insulator layer to provide exposed fin portions. A gate electrode structure overlies the exposed fin portions and is electrically insulated from the fins by a gate insulating layer. Epitaxially-grown source regions and drain regions are disposed adjacent to the gate electrode structure. The epitaxially-grown source regions and drain regions have an asymmetric profile along a lateral direction perpendicular to a length of the fins.
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