- Patent Title: Formation method of semiconductor device structure with gate stack
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Application No.: US15467643Application Date: 2017-03-23
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Publication No.: US10032916B2Publication Date: 2018-07-24
- Inventor: Che-Cheng Chang , Chih-Han Lin
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Main IPC: H01L21/336
- IPC: H01L21/336 ; H01L29/78 ; H01L29/423 ; H01L29/66 ; H01L29/417 ; H01L21/28

Abstract:
A method for forming a semiconductor device structure is provided. The method includes forming a dummy gate stack over a semiconductor substrate and forming spacer elements over sidewalls of the dummy gate stack. The method also includes removing the dummy gate stack to form a recess between the spacer elements and partially removing the spacer elements such that an upper portion of the recess becomes wider. The method further includes forming a metal gate stack in the recess and forming a protection element in the recess to cover the metal gate stack.
Public/Granted literature
- US20170207337A1 FORMATION METHOD OF SEMICONDUCTOR DEVICE STRUCTURE WITH GATE STACK Public/Granted day:2017-07-20
Information query
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