Invention Grant
- Patent Title: Magnetically guided chiplet displacement
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Application No.: US15416488Application Date: 2017-01-26
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Publication No.: US10032973B1Publication Date: 2018-07-24
- Inventor: Stephen W. Bedell , Bing Dang , Ning Li , Frank R. Libsch , Devendra K. Sadana
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Scully, Scott, Murphy & Presser, P.C.
- Agent Louis J. Percello, Esq.
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L33/62 ; H01L25/075

Abstract:
Magnetic regions of at least one of chiplet or a receiving substrate are used to permit magnetically guided precision placement of chiplets on the receiving substrate. In some embodiments, a scanning magnetic head can be used to release individual chiplets from a temporary support substrate to the receiving substrate. Structures are provided in which a magnetic moment of a controlled orientation exists between the transferred chiplets and the receiving substrate.
Public/Granted literature
- US20180212120A1 MAGNETICALLY GUIDED CHIPLET DISPLACEMENT Public/Granted day:2018-07-26
Information query
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