A headphone includes an ear-cup housing and an audio driver. The audio driver has a driver housing, and a driver aperture extending through the audio driver from an exterior thereof toward a diaphragm. A mass port plug is disposed at least partially within the driver aperture extending through the audio driver. The mass port plug has an acoustic aperture extending through the mass port plug from a first side thereof to an opposing second side thereof, and the acoustic aperture is configured to cause the audio driver to exhibit a selected detectable sound pressure level (SPL) profile. Methods of fabricating headphones include insertion of such a mass port plug into a driver aperture extending through an audio driver. The mass port plugs and methods may be used to adapt substantially identical audio drivers for use in ear-cup housings having differing configurations while providing selected detectable sound pressure level profiles.