Invention Grant
- Patent Title: Resin composition for printed wiring board, prepreg, metal foil-clad laminate, resin composite sheet, and printed wiring board
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Application No.: US15112251Application Date: 2015-02-03
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Publication No.: US10034371B2Publication Date: 2018-07-24
- Inventor: Kenji Arii , Takashi Kobayashi , Masanobu Sogame , Yoshinori Mabuchi , Sotaro Hiramatsu
- Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.
- Applicant Address: JP Tokyo
- Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.
- Current Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.
- Current Assignee Address: JP Tokyo
- Agency: Greenblum & Bernstein, P.L.C.
- Priority: JP2014-019555 20140204
- International Application: PCT/JP2015/053017 WO 20150203
- International Announcement: WO2015/119121 WO 20150813
- Main IPC: H05K1/03
- IPC: H05K1/03 ; B32B15/092 ; B32B27/04 ; B32B27/38 ; C08G59/18 ; C08L63/00 ; C08J5/24 ; B32B27/20 ; C08K3/36 ; C08K5/315 ; H05K3/02
Abstract:
A resin composition for a printed wiring board including: a cyanate compound represented by the following general formula (1); and an epoxy resin,
Public/Granted literature
Information query
