Invention Grant
- Patent Title: Manufacturing method of part-mounting package
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Application No.: US14597935Application Date: 2015-01-15
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Publication No.: US10034383B2Publication Date: 2018-07-24
- Inventor: Kazushige Akita
- Applicant: NGK SPARK PLUG CO., LTD.
- Applicant Address: JP Nagoya
- Assignee: NGK SPARK PLUG CO., LTD.
- Current Assignee: NGK SPARK PLUG CO., LTD.
- Current Assignee Address: JP Nagoya
- Agency: Stites & Harbison, PLLC
- Agent Jeffrey A. Haeberlin; James R. Hayne
- Priority: JP2014-008154 20140120
- Main IPC: H05K3/00
- IPC: H05K3/00 ; H05K3/46 ; H05K3/10 ; H05K3/40 ; H05K1/11 ; H05K1/18

Abstract:
A method of manufacturing a part-mounting package includes: forming a first through-hole in a first insulating sheet and forming a second through-hole whose opening area is larger than the first through-hole in a second insulating sheet; forming a penetration conductor covering an inner surface of the second through-hole and forming a conductor layer on a surface of at least the second insulating sheet; laminating the first insulating sheet and the second insulating sheet where center positions of the first through-hole and the second through-hole are matched to each other; causing linear laser division grooves to pass through a center of the first through-hole and the second through-hole; and dividing the sheet laminated body along the laser division grooves, and causing the side surface recess part and the end face through-hole conductor to appear.
Public/Granted literature
- US20150208512A1 MANUFACTURING METHOD OF PART-MOUNTING PACKAGE Public/Granted day:2015-07-23
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