Invention Grant
- Patent Title: Backlight module and a manufacturing method thereof, back plate and display device
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Application No.: US15526872Application Date: 2016-08-02
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Publication No.: US10036920B2Publication Date: 2018-07-31
- Inventor: Haiyun Lin , Qinghui Zhao , Dongzhao Li , Jingpeng Li
- Applicant: BOE TECHNOLOGY GROUP CO., LTD. , BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Applicant Address: CN Beijing CN Beijing
- Assignee: BOE TECHNOLOGY GROUP CO., LTD.,BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Current Assignee: BOE TECHNOLOGY GROUP CO., LTD.,BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Current Assignee Address: CN Beijing CN Beijing
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: CN201610223557 20160412
- International Application: PCT/CN2016/092840 WO 20160802
- International Announcement: WO2017/177579 WO 20171019
- Main IPC: G02F1/1335
- IPC: G02F1/1335

Abstract:
The present disclosure provides a backlight module and a method of manufacturing the same, as well as a back plate and a display device, the backlight module comprising: a backlight strip; a solder spot disposed on a back surface of the backlight strip; light strip glue attached to the side of the backlight strip on which the solder spot is disposed; and a back plate disposed on the side of the light strip glue away from the backlight strip; wherein a groove is provided on the side of the back plate adjacent to the light strip glue and at a position corresponding to the solder spot.
Public/Granted literature
- US20180149923A1 Backlight Module And A Manufacturing Method Thereof, Back Plate And Display Device Public/Granted day:2018-05-31
Information query
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