Invention Grant
- Patent Title: Semiconductor package and fabricating method thereof
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Application No.: US15447831Application Date: 2017-03-02
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Publication No.: US10037949B1Publication Date: 2018-07-31
- Inventor: Hee Sung Kim , Yeoung Beom Ko , Dae Byoung Kang , Jae Jin Lee , Joon Dong Kim , Dong Jean Kim
- Applicant: Amkor Technology, Inc.
- Applicant Address: US AZ Tempe
- Assignee: Amkor Technology, Inc.
- Current Assignee: Amkor Technology, Inc.
- Current Assignee Address: US AZ Tempe
- Agency: McAndrews, Held & Malloy, Ltd.
- Main IPC: H01L23/552
- IPC: H01L23/552 ; H01L21/78 ; H01L21/56 ; H01L21/683 ; H01L23/00 ; H01L23/31 ; H01L25/16
Abstract:
A semiconductor package that includes EMI shielding and a fabricating method thereof are disclosed. In one embodiment, the fabricating method of a semiconductor package includes forming a substrate, attaching semiconductor devices to a top portion of the substrate, encapsulating the semiconductor devices using an encapsulant, forming a trench in the encapsulant, and forming a shielding layer on a surface of the encapsulant.
Information query
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