The present application discloses a light emitting diode packaging structure comprising a base substrate; a metal lead on the base substrate; a cover plate; and a seal frame sealing the cover plate and the base substrate together and forming an enclosure surrounding a display area of the base substrate. The metal lead extends from the display area outwardly and passes through below the seal frame to outside of the enclosure. The metal lead has a curved configuration in plan view of the base substrate within a region where the metal lead overlaps with the seal frame.