Invention Grant
- Patent Title: Multi-core cable and multi-core cable with substrate
-
Application No.: US15306536Application Date: 2014-05-16
-
Publication No.: US10038257B2Publication Date: 2018-07-31
- Inventor: Takeki Ishimoto
- Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD.
- Applicant Address: JP Osaka-shi, Osaka
- Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.
- Current Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.
- Current Assignee Address: JP Osaka-shi, Osaka
- Agency: Drinker Biddle & Reath LLP
- International Application: PCT/CN2014/077658 WO 20140516
- International Announcement: WO2015/172377 WO 20151119
- Main IPC: H01R9/05
- IPC: H01R9/05 ; H02G15/04 ; H02G15/013 ; H01R12/62 ; H01B7/18 ; H02G15/02 ; H01R12/59

Abstract:
A plurality of electronic wires are fixed by a mold part in a state arranged in at least two rows. The mold part has a first end face from which the electronic wires of a first row in the plurality of electronic wires protrude and a second end face from which the electronic wires of a second row in the plurality of electronic wires protrude. An angle of the first end face with respect to a direction of a central axis line of a multi-core cable differs from an angle of the second end face with respect to the direction of the central axis line. The electronic wires of the first row in the first end face protrude along a direction away from the electronic wires of the second row protruding from the second end face.
Public/Granted literature
- US20170047671A1 MULTI-CORE CABLE AND MULTI-CORE CABLE WITH SUBSTRATE Public/Granted day:2017-02-16
Information query