Molded electronic structures configured for use in body-mountable devices and methods for embedding molded electronic structures in a body-mountable device are described. An example method may include molding an electronic structure to have first curvature corresponding to a first radius of curvature. The electronic structure may include an antenna, a sensor, and an electronic device. The example method may also include adhering the molded electronic structure to a first polymer layer. The example method may additionally include forming a second polymer layer over the molded electronic structure adhered to the first polymer layer.