Invention Grant
- Patent Title: Microminiature chainmail interface between skin and a transcutaneous prosthetic device and a method of manufacture
-
Application No.: US14996040Application Date: 2016-01-14
-
Publication No.: US10039651B2Publication Date: 2018-08-07
- Inventor: Lee E. Weiss , Gary K. Fedder
- Applicant: CARNEGIE MELLON UNIVERSITY
- Applicant Address: US PA Pittsburgh
- Assignee: CARNEGIE MELLON UNIVERSITY, a Pennsylvania Non-Profit Corporation
- Current Assignee: CARNEGIE MELLON UNIVERSITY, a Pennsylvania Non-Profit Corporation
- Current Assignee Address: US PA Pittsburgh
- Agent Michael G. Monyok; David G. Oberdick
- Main IPC: A61F2/78
- IPC: A61F2/78 ; A61F2/28 ; A61F2/60 ; A61B17/80 ; B22F3/105 ; B33Y80/00 ; B29C64/153 ; A61F2/50 ; A61F2/30 ; A61F2/00

Abstract:
The disclosure describes a direct skeletal attachment (DSA) device including a micro-miniature chainmail skin-to-DSA interface. The interface comprises various porous architectures for skin ingrowth and integration as barriers against pathogens. Failure of skin-to-DSA interfaces can occur due to mismatches in mechanical compliance between pliable skin and more rigid DSA interfaces. To address this problem, in embodiments disclosed herein is an interface having a gradient in mechanical compliance or link mobility, ranging from fully flexible, to less compliant, to rigid where it attaches to the main DSA body.
Public/Granted literature
Information query
IPC分类: