Invention Grant
- Patent Title: Ultrasonic transducer element chip, probe, electronic instrument, and ultrasonic diagnostic device
-
Application No.: US15383684Application Date: 2016-12-19
-
Publication No.: US10040098B2Publication Date: 2018-08-07
- Inventor: Tomoaki Nakamura , Jiro Tsuruno , Kanechika Kiyose
- Applicant: SEIKO EPSON CORPORATION
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Priority: JP2012-078672 20120330
- Main IPC: B06B1/06
- IPC: B06B1/06 ; A61B8/00 ; A61B8/08 ; G01S15/89 ; H01L41/08 ; H01L41/22
Abstract:
An ultrasonic transducer element chip includes a substrate defining an opening, an ultrasonic transducer element disposed at a position corresponding to the opening in a thickness direction of the substrate, and a reinforcing member connected to the substrate to cover the opening. The reinforcing member defines a ventilation passage from the opening to an outside of the substrate.
Public/Granted literature
- US20170095838A1 ULTRASONIC TRANSDUCER ELEMENT CHIP, PROBE, ELECTRONIC INSTRUMENT, AND ULTRASONIC DIAGNOSTIC DEVICE Public/Granted day:2017-04-06
Information query
IPC分类:
