Invention Grant
- Patent Title: Substrate processing method
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Application No.: US14223391Application Date: 2014-03-24
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Publication No.: US10040102B2Publication Date: 2018-08-07
- Inventor: Ichiro Mitsuyoshi , Jun Shibukawa , Shinji Kiyokawa , Tomohiro Kurebayashi
- Applicant: DAINIPPON SCREEN MFG. CO., LTD.
- Applicant Address: JP
- Assignee: SCREEN Holdings Co., Ltd.
- Current Assignee: SCREEN Holdings Co., Ltd.
- Current Assignee Address: JP
- Agency: Ostrolenk Faber LLP
- Priority: JP2006-351999 20061227
- Main IPC: B08B3/04
- IPC: B08B3/04 ; H01L21/67 ; H01L21/677

Abstract:
A substrate processing apparatus has an indexer block and a processing block. One side of the processing block has a vertical stack of a plurality of top surface cleaning units and the other side of the processing block has a vertical stack of a plurality of back surface cleaning units. Reversing units for reversing the substrate W are provided one above the other between the indexer block and the processing block. For example, one reversing unit is used for reversing the substrate before a back surface cleaning processing by the back surface cleaning unit or for other purposes, and the other reversing unit is used for placing the substrate W after a top surface cleaning processing by the top surface cleaning unit or for other purposes.
Public/Granted literature
- US20140202499A1 SUBSTRATE PROCESSING METHOD Public/Granted day:2014-07-24
Information query
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