Invention Grant
- Patent Title: Adhesion promoter, addition curable organopolysiloxane resin composition and semiconductor apparatus
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Application No.: US15295514Application Date: 2016-10-17
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Publication No.: US10040924B2Publication Date: 2018-08-07
- Inventor: Tomoyuki Mizunashi , Hiroyuki Iguchi
- Applicant: SHIN-ETSU CHEMICAL CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: SHIN-ETSU CHEMICAL CO., LTD.
- Current Assignee: SHIN-ETSU CHEMICAL CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JP2015-215958 20151102
- Main IPC: C08K5/5475
- IPC: C08K5/5475 ; C08G77/08 ; H01L33/26 ; H01L33/56 ; H01L33/58 ; C09J183/04 ; C08G77/00 ; C08G77/12 ; C08G77/20

Abstract:
The present invention provides an adhesion promoter for promoting adhesiveness of a cured product of an addition curable organopolysiloxane resin composition, the adhesion promoter comprising at least one alkoxy group bonded to a silicon atom, and at least one cyano group-containing organic group bonded to a silicon atom in one molecule. There can be provided an adhesion promoter which can make a cured product of an addition curable organopolysiloxane resin composition excellent in heat resistance, workability, adhesiveness, and gas barrier property by adding it to the composition.
Public/Granted literature
- US20170121504A1 ADHESION PROMOTER, ADDITION CURABLE ORGANOPOLYSILOXANE RESIN COMPOSITION AND SEMICONDUCTOR APPARATUS Public/Granted day:2017-05-04
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