Invention Grant
- Patent Title: Thermally conductive sheet
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Application No.: US14911451Application Date: 2014-09-10
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Publication No.: US10040979B2Publication Date: 2018-08-07
- Inventor: Junichiro Sugita
- Applicant: Dexerials Corporation
- Applicant Address: JP Tokyo
- Assignee: DEXERIALS CORPORATION
- Current Assignee: DEXERIALS CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Procopio, Cory, Hargreaves & Savitch LLP
- Priority: JP2013-190090 20130913; JP2014-183931 20140910
- International Application: PCT/JP2014/073954 WO 20140910
- International Announcement: WO2015/037626 WO 20150319
- Main IPC: C09J7/20
- IPC: C09J7/20 ; C09J133/08 ; C09J133/06 ; C09J9/00 ; C09J11/04 ; C09J11/06 ; C08K3/20 ; C08K3/08 ; C08K3/04 ; H01L23/373 ; C09J7/38 ; C09J7/24 ; C08K3/32 ; C08K5/3492

Abstract:
A thermally conductive sheet having an adhesive layer and a non-adhesive layer laminated together. The adhesive layer contains an acrylic resin formed from an acrylic compound and a thermally conductive filler, and has a tack property higher than a tack property of the non-adhesive layer. The non-adhesive layer is formed from a resin having a glass transition temperature of 10° C. or more and at least one functional group selected from a hydroxy, a carboxyl and a glycidyl, a curing agent and a flame retardant filler. The tack property of the non-adhesive layer is from 6 to 30 kN/m2 measured by pressing and then peeling an aluminum cylindrical probe from the non-adhesive layer with a pressing speed of 30 mm/min, peeling speed of 120 mm/min, load of 196 g, pressing time of 5.0 sec, pulling distance of 5 mm, probe heating of 40° C. and sheet stage heating of 40° C.
Public/Granted literature
- US20160194529A1 THERMALLY CONDUCTIVE SHEET Public/Granted day:2016-07-07
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