A multifunction integrated connection head assembly structure includes a first connection head module and a second connection head module. The first connection head module includes a first carrier body, at least two first fluid connectors, a first power connector, and a first retaining body. The second connection head module includes a second carrier body detachably connected with the first carrier body, at least two second fluid connectors respectively detachably connected with the at least two first fluid connectors, a second power connector detachably electrically connected with the first power connector, and a second retaining body detachably mated with the first retaining body. An electrical device using a multifunction integrated connection head assembly structure is further disclosed.