Invention Grant
- Patent Title: Damping component and integrated-circuit testing apparatus using the same
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Application No.: US15397754Application Date: 2017-01-04
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Publication No.: US10041817B2Publication Date: 2018-08-07
- Inventor: Chih-Chieh Liao , Yu-Min Sun , Chih-Feng Cheng
- Applicant: GLOBAL UNICHIP CORPORATION , TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Applicant Address: TW Hsinchu TW Hsinchu
- Assignee: GLOBAL UNICHIP CORPORATION,TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: GLOBAL UNICHIP CORPORATION,TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu TW Hsinchu
- Agency: CKC & Partners Co., Ltd.
- Priority: CN201610849372 20160926
- Main IPC: G01D11/12
- IPC: G01D11/12 ; B60T17/08 ; G01R31/44 ; G01R31/26

Abstract:
An embodiment of the present disclosure provides a damping component. The damping component includes a housing, at least one sliding piece, a fluid, and at least one damping elastomer. The housing may have at least one opening. The sliding piece slidably seals the opening, and partially protrudes outside the opening, to form an accommodation space within the housing. The fluid can fill up the accommodation space. The damping elastomer can be disposed inside the accommodation space.
Public/Granted literature
- US20180087936A1 DAMPING COMPONENT AND INTEGRATED-CIRCUIT TESTING APPARATUS USING THE SAME Public/Granted day:2018-03-29
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