Invention Grant
- Patent Title: Transducer sensor housing
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Application No.: US15008397Application Date: 2016-01-27
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Publication No.: US10041819B2Publication Date: 2018-08-07
- Inventor: Yoichi Tanizaki
- Applicant: PHC Holdings Corporation
- Applicant Address: JP Tokyo
- Assignee: PHC Holdings Corporation
- Current Assignee: PHC Holdings Corporation
- Current Assignee Address: JP Tokyo
- Agency: Shinjyu Global IP
- Priority: JP2012-131620 20120611; JP2013-080947 20130409
- Main IPC: A61B5/15
- IPC: A61B5/15 ; G01D11/24 ; G01N33/487 ; B65D83/08

Abstract:
A sensor housing container comprises a container having an opening, a lid that covers the opening, and a sensor housing body that can be pulled out of the opening of the container. The sensor housing body includes a sensor case, a plurality of sensors, and a spring that biases these sensors. The sensor case is provided with a sensor discharge port at the portion where the sensors are biased by the spring. Also, this sensor discharge port is provided with a guide protrusion for aligning the sensor discharge port with a sensor insertion port of a measurement device. Furthermore, the inner face of the container is provided with a push-out protrusion that contacts with the end of the sensors on the opposite side from electrodes, at the portion corresponding to the end of the sensors on the opposite side from the electrodes inside the sensor case.
Public/Granted literature
- US20160138947A1 SENSOR HOUSING CONTAINER AND SENSOR ATTACHMENT METHOD USING SAME Public/Granted day:2016-05-19
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