A heat-insulation material does not cause deterioration in heat-insulation performance and any loss of components included therein, and possesses an excellent radiation-preventing function. The heat-insulation material includes: a first heat-insulation layer that includes a first silica xerogel and a first radiation-preventing material; and a third heat-insulation layer that includes a third silica xerogel and second fibers, wherein the first heat-insulation layer and the third heat-insulation layer are layered. An electronic device includes the heat-insulation material. Yet further disclosed is a method for producing the heat-insulation material.