An imprint apparatus for forming a pattern on a substrate by contacting an imprint material on the substrate with a mold includes a mold holding member configured to hold the mold and a mold deforming mechanism for applying a force to a side surface of the mold in a direction along a pattern face of the mold in which the pattern is formed in order to deform the pattern formed in the mold held by the mold holding member. The mold deforming mechanism includes a contact portion to contact with the side surface of the mold to press against the side surface. The contact portion is shaped such that a dimension of part of the contact portion to contact with the side surface of the mold is less than a dimension of part of the contact portion away from the side surface of the mold.