Invention Grant
- Patent Title: Electronic device packages and methods
-
Application No.: US13657959Application Date: 2012-10-23
-
Publication No.: US10043052B2Publication Date: 2018-08-07
- Inventor: Paul Wickboldt , Khamvong Thammasouk
- Applicant: Synaptics Incorporated
- Applicant Address: US CA San Jose
- Assignee: Synaptics Incorporated
- Current Assignee: Synaptics Incorporated
- Current Assignee Address: US CA San Jose
- Agency: Leydig, Voit & Mayer, Ltd.
- Main IPC: G06K9/00
- IPC: G06K9/00
Abstract:
Electronic devices are described which are adapted and configured to incorporate a fingerprint sensor within a recess or aperture, formed or molded in the housing, such that the fingerprint sensor interface is within 500 microns of an exterior surface of the device. Methods of use and manufacture are also described.
Public/Granted literature
- US20130108124A1 ELECTRONIC DEVICE PACKAGES AND METHODS Public/Granted day:2013-05-02
Information query
