Invention Grant
- Patent Title: SRAM structure
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Application No.: US15672426Application Date: 2017-08-09
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Publication No.: US10043571B1Publication Date: 2018-08-07
- Inventor: Jhon-Jhy Liaw
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: McClure, Qualey & Rodack, LLP
- Main IPC: G11C11/419
- IPC: G11C11/419 ; G11C11/417 ; H01L27/11 ; G11C5/06 ; H01L27/02

Abstract:
SRAM structures are provided. A SRAM structure includes multiple SRAM cells arranged in multiple rows and multiple columns. The SRAM cells in the same row are divided into multiple groups. Each group includes a first SRAM cell and a second SRAM cell adjacent to the first SRAM cell. The first and second Vss lines and the first and second word-line landing pads are formed in a first metallization layer and extend parallel to a first direction. The third Vss line and the first word line are formed in a second metallization layer and extend parallel to a second direction. The first word-line landing pad is positioned within the rectangular shape of the first or second SRAM cell, and the second word-line landing pad is positioned within the rectangular shape of the second SRAM cell. The second metallization layer is positioned on the first metallization layer.
Public/Granted literature
- US1698058A Package of sensitized material for X-ray purposes Public/Granted day:1929-01-08
Information query
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