Invention Grant
- Patent Title: Composite electronic component and board having the same mounted thereon
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Application No.: US15436085Application Date: 2017-02-17
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Publication No.: US10043613B2Publication Date: 2018-08-07
- Inventor: Ho Yoon Kim
- Applicant: Samsung Electro-Mechanics, Co., Ltd.
- Applicant Address: KR Suwon-si, Gyeonggi-Do
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si, Gyeonggi-Do
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2016-0152725 20161116
- Main IPC: H01G2/00
- IPC: H01G2/00 ; H01G4/30 ; H01G4/012 ; H01G4/248 ; H01G4/224 ; H01G4/002 ; H05K1/18 ; H05K1/11

Abstract:
A composite electronic component includes: a composite including a capacitor body including a plurality of dielectric layers and a plurality of internal electrodes alternately disposed with respective dielectric layers interposed therebetween, external electrodes extending from third and fourth surfaces of the capacitor body to portions of the first, second, fifth, and sixth surfaces, respectively, a discharge layer disposed between the external electrodes on the second surface of the capacitor body, and a protective layer disposed on the discharge layer; and conductive resin layers overlapping the third and fourth surfaces and portions of the first, second, fifth, and sixth surfaces, respectively. Widths of portions of the external electrodes formed on the first surface of the capacitor body are greater than widths of portions of the first and second conductive resin layers overlapping the first surface of the capacitor body.
Public/Granted literature
- US20180137979A1 COMPOSITE ELECTRONIC COMPONENT AND BOARD HAVING THE SAME MOUNTED THEREON Public/Granted day:2018-05-17
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