Invention Grant
- Patent Title: Local semiconductor wafer thinning
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Application No.: US14884090Application Date: 2015-10-15
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Publication No.: US10043676B2Publication Date: 2018-08-07
- Inventor: Sanfilippo Carmelo , Luigi Merlin , Isabella Para , Giovanni Richieri
- Applicant: Vishay General Semiconductor LLC
- Applicant Address: US NY Hauppauge
- Assignee: VISHAY GENERAL SEMICONDUCTOR LLC
- Current Assignee: VISHAY GENERAL SEMICONDUCTOR LLC
- Current Assignee Address: US NY Hauppauge
- Agency: Mayer & Williams PC
- Agent Stuart H. Mayer
- Main IPC: H01L23/367
- IPC: H01L23/367 ; H01L21/308 ; H01L23/373 ; H01L23/00 ; H01L29/06 ; H01L23/48
Abstract:
A local thinning process is employed on the backside of a semiconductor substrate such as a wafer in order to improve the thermal performance of the electronic device built on or in the front side of the wafer.
Public/Granted literature
- US20170110329A1 LOCAL SEMICONDUCTOR WAFER THINNING Public/Granted day:2017-04-20
Information query
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