Invention Grant
- Patent Title: Systems and methods for interconnect simulation and characterization
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Application No.: US15367318Application Date: 2016-12-02
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Publication No.: US10043720B2Publication Date: 2018-08-07
- Inventor: Blake Rogers , Amaneh Tasooji
- Applicant: Blake Rogers , Amaneh Tasooji
- Applicant Address: US AZ Scottsdale
- Assignee: Arizona Board of Regents
- Current Assignee: Arizona Board of Regents
- Current Assignee Address: US AZ Scottsdale
- Agency: Snell & Wilmer L.L.P.
- Main IPC: H01L21/28
- IPC: H01L21/28 ; H01L21/66 ; H01L23/00 ; G01R31/28
Abstract:
Exemplary systems and methods allow for precise formation and subsequent characterization of electrical interconnects, for example solder joints associated with integrated circuit packages. The system may utilize a cartridge-like structure for use in aligning the metal components to be interconnected, and to facilitate subsequent testing of the interconnect.
Public/Granted literature
- US20170162454A1 SYSTEMS AND METHODS FOR INTERCONNECT SIMULATION AND CHARACTERIZATION Public/Granted day:2017-06-08
Information query
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