A semiconductor module includes: first semiconductor devices; second semiconductor devices; a first and second wires. Each first semiconductor device comprises: first sealing resin; first-third terminals; a first semiconductor chip connected to the first and third terminals. Each second semiconductor device comprises: second sealing resin; fourth-sixth terminals; a second semiconductor chip connected to the fourth and fifth terminals, and not connected to the sixth terminal. The first and second semiconductor devices are stacked along a stacking direction. The first terminals and the fourth terminals are arranged in a line along the stacking direction. The second terminals and the fifth terminals are arranged in a line along the stacking direction. The third terminals and the sixth terminals are arranged in a line along the stacking direction. The first wire is connected to the fifth terminals. The second wire is connected to the third terminals.