A semiconductor device includes a leadframe, a semiconductor chip mounted on the leadframe, and an encapsulation resin covering the leadframe and the semiconductor chip. The leadframe includes a terminal having a pillar shape. The terminal includes a first end surface, a second end surface facing away from the first end surface, and a side surface extending vertically between the first end surface and the second end surface. The side surface is stepped to form a step surface facing away from the second end surface and having an uneven surface part formed therein. A first portion of the terminal extending from the first end surface toward the second end surface and including the step surface is covered with the encapsulation resin. A second portion of the terminal extending from the first portion to the second end surface projects from the encapsulation resin.