Invention Grant
- Patent Title: Optoelectronic chip embedded organic substrate
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Application No.: US15402705Application Date: 2017-01-10
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Publication No.: US10043787B2Publication Date: 2018-08-07
- Inventor: Masao Tokunari
- Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Agency: Tutunjian & Bitetto, P.C.
- Agent Vazken Alexanian
- Main IPC: H01L25/16
- IPC: H01L25/16 ; H01S5/183 ; H01S5/022 ; H01L31/02 ; H01L31/0232 ; H01S5/00

Abstract:
Optoelectronic devices and method of forming the same include an optoelectronic chip in a substrate layer, the optoelectronic chip having one or more optoelectronic components. An integrated circuit chip is positioned on the substrate layer. A lens array is positioned on the substrate layer above the optoelectronic chip and above at least part of the integrated circuit chip. The lens array includes one or more lens positioned directly respective optoelectronic components.
Public/Granted literature
- US20180197842A1 OPTOELECTRONIC CHIP EMBEDDED ORGANIC SUBSTRATE Public/Granted day:2018-07-12
Information query
IPC分类: